Based on the Chinese RK3588S Hardware Design Guide V1.2 (2023-12-14) for circuit and PCB review. CM7S carriers must follow module interface definitions; Sige7S supports software and peripheral evaluation. SoC capabilities are not a board connector list. Verify SDK/BSP, kernel, board revision, firmware and multiplexing. Values are source references, not ArmSoM hardware measurements.
Reading path
CM7S supports custom carriers: first identify supplies, DDR and boot circuits already integrated in the module, then design outside its connectors. Sige7S provides a starting point for software and peripheral evaluation. For both products, verify exposed interfaces, pin assignments, levels, system images and cooling against the relevant revision. A chip reference schematic is not a product wiring diagram.
- RK3588S and CM7S carrier design: resources and validation
- RK3588S clocks: 24MHz, 32kHz and layout
- RK3588S reset, watchdog and thermal protection
- RK3588S boot and recovery: Maskrom, JTAG and UART
- RK3588S rails: startup requirements and unused PHYs
- RK3588S power sequencing: RESETn and S0/S3
- RK3588S and RK806: single and dual PMIC power trees
- RK3588S DDR circuits: LPDDR4/4X/5 and capacity
- RK3588S DDR routing: length and delay matching
- RK3588S eMMC: clock, pull-ups and strobe
- RK3588S FSPI Flash: boot, supply and matching
- RK3588S SDMMC and SDIO Wi-Fi: voltage switching and protection
- RK3588S USB and Type-C: controllers, PHYs and recovery
- RK3588S SATA: three controllers and shared PHYs
- RK3588S PCIe: lanes, reference clocks and supplies
- RK3588S cameras: CSI, D/C PHY and CIF planning
- RK3588S versus RK3588S2: camera PHYs and compatibility
- RK3588S HDMI TX: FRL, TMDS and compatibility circuits
- RK3588S MIPI displays: D-PHY, C-PHY and panel integration
- RK3588S DP and eDP: shared PHYs, AUX and coupling
- RK3588S audio hardware: I2S, PDM and microphone arrays
- RK3588S Ethernet hardware: GMAC, PHY and clock direction
- RK3588S GPIO and SARADC: domains and button inputs
- RK3588S UART, SPI, CAN, I2C and PWM allocation
- RK3588S stackup and fanout: HDI versus through-hole
- RK3588S high-speed PCB: pads and vias above 8GT/s
- RK3588S power PCB and PDN: copper, returns and decoupling
- RK3588S thermal design: reference resistance and system validation
- RK3588S ESD and EMI: interface protection and return paths
- RK3588S assembly and storage: reflow, MSL3 and bake records
Using source figures
No corresponding English design guide was found for this batch. All four editions use Chinese source screenshots with localized captions. Open an image for full resolution; the article text and parameter tables remain copyable. Page references are physical PDF pages.