Based on the Chinese RK3588S Hardware Design Guide V1.2 (2023-12-14) for circuit and PCB review. CM7S carriers must follow module interface definitions; Sige7S supports software and peripheral evaluation. SoC capabilities are not a board connector list. Verify SDK/BSP, kernel, board revision, firmware and multiplexing. Values are source references, not ArmSoM hardware measurements.
RK3588S Hardware Design Guide V1.2 (2023-12-14), CN · §6–7
Process limits apply to the chip package
The reflow profile covers the RK3588S chip, not permission to reflow a complete CM7S module or Sige7S board. Reference solder-paste storage is 2–10°C with 3–4 hours warming at room temperature. Production engineering must reconcile alloy, flux, board thermal mass and connector limits. Follow product assembly instructions for module connections.
Track cumulative moisture exposure
RK3588S is MSL3 with 168-hour floor life at ≤30°C/60%RH. Record humidity card, opening time and storage; resealing does not automatically reset exposure. Table 7-2 distinguishes floor-life overrun above/below 72 hours and bake temperature, with package thickness ≤1.4mm. The MSL1 row’s 300°C is suspect and is not treated here as a production condition.
Design parameters and review table
| Item | Source reference |
|---|---|
| MSL3 floor life | 168h at ≤30°C /60%RH |
| Bake 125°C +10/-0°C (>72h / ≤72h overrun) | 9h /7h |
| Bake 90°C +8/-0°C (>72h / ≤72h overrun) | 33h /23h |
| Bake 40°C +5/-0°C (>72h / ≤72h overrun) | 13 days /9 days |
| Bake table package limit | Thickness ≤1.4mm |
Source figures
No corresponding English design guide was found for this batch. All four editions use Chinese source screenshots with localized captions. Open an image for full resolution; the article text and parameter tables remain copyable. Page references are physical PDF pages.
Chinese original · PDF 238 · 6-4
Chinese original · PDF 240 · 7-2
ArmSoM development path
CM7S supports custom carriers: first identify supplies, DDR and boot circuits already integrated in the module, then design outside its connectors. Sige7S provides a starting point for software and peripheral evaluation. For both products, verify exposed interfaces, pin assignments, levels, system images and cooling against the relevant revision. A chip reference schematic is not a product wiring diagram.