Based on RK3506 Hardware Design Guide V1.0 (2024-09), covering G2 and B/J. Verify package, memory, rails and pins by variant and CM1/Forge1 interfaces against board documentation. This is an engineering topic article, not a complete page-by-page translation. Values are source references, not ArmSoM hardware measurements. Validate the actual SDK/BSP, kernel and firmware.
Read by design stage
- RK3506 minimum system: clocks, reset and recovery · §2.1.1–2.1.5; §2.3.2; §3.3.1
- RK3506 power domains: G2, B/J and carrier boundaries · §1.2; §2.1.9; §2.2; §3.3.2
- RK3506 DDR, eMMC and FSPI: circuits and routing · §2.1.6–2.1.8; §3.3.9–3.3.12
- RK3506 display, USB and RM_IO allocation · §2.3.4–2.3.6; §3.3.3–3.3.4; §3.3.11
- RK3506 audio design: SAI, PDM, ASRC and DSM · §2.3.7; §3.3.13
- RK3506 industrial interfaces: RMII, FlexBus, DSMC and controls · §2.3.8–2.3.17; §3.3.5–3.3.7
- RK3506 thermal, ESD and production review · §3.1–3.2; §4–7