Rockchip UFS Approved Vendor List: RK3576 Device Selection Reference

This is a platform-level component-selection reference for ArmSoM projects, not a list of interchangeable parts verified on every ArmSoM board. For Sige7 (RK3588) and CM5 (RK3576), consult the exact SoC column, schematic, populated BOM, package, power rails and board revision. Board-level signal integrity and production validation remain necessary. The source does not specify one universal SDK/BSP or kernel version; match your released BSP, boot firmware and drivers, and obey the part-specific notes. No hardware tests were performed for this article; source statuses and examples are not ArmSoM measurements.

This UFS list contains an RK3576 column only. CM5 uses RK3576, but its documented onboard storage is eMMC; the list does not establish a usable UFS interface on CM5 or UFS support on RK3588 boards. Treat it as a reference for custom RK3576 hardware until the schematic and BSP support are verified.

Source: Rockchip_UFS_Approved_Vendor_List_Ver1.04.pdf, V1.04.

The files supplied in the Chinese and English folders are byte-identical and primarily English. All three editions use the same original figures; there are no separate Chinese-language figures. Cover/legal text and revision history are omitted. Technical footnotes are retained.

ArmSoM Sige7 · ArmSoM CM5 · Editorial notes

1. How to read this list

Status symbols describe the source validation scope, not automatic approval for your board. Empty cells remain empty; do not interpret them as support. Part numbers, suffixes, quantities and platform statuses are preserved. EOL means end of life; AUTO and IT are retained as source labels, not newly certified qualifications.

Symbol	Meaning in this document
√	Fully tested, applicable and in mass production.
T/A	Fully tested, applicable and ready for mass production.
S/A	Samples passed reliability testing; platform compatibility testing is still required before mass production.
D/A	Applicable according to the datasheet; samples still need testing.
N/A	Not applicable.

Complete compatibility tables

Tables are separated by source page for traceability, not shortened. Scroll horizontally to see every SoC column. Repeated source entries are retained, including conflicting duplicates.

Source page 4

Manufacturer	Part number	Device size (bits)	Byte size	Process	Version	VCC （V）	VCCQ （V）	VCCQ2 （V）	Temperature (°C)	RK3576	Remarks
KIOXIA	THGJFGT2T85BAB5	512Gb TLC x 8	512GB	3D	3.1	2.5/3.3	1.2	-	-40/105	T/A	AUTO
KIOXIA	THGJFGT1T45BAB8	512Gb TLC x 4	256GB	3D	3.1	2.5/3.3	1.2	-	-40/105	T/A	AUTO
KIOXIA	THGJFGT0T25BAB8	512Gb TLC x 2	128GB	3D	3.1	2.5/3.3	1.2	-	-40/105	T/A	AUTO
KIOXIA	THGJFGG9T15BAB8	512Gb TLC x 1	64GB	3D	3.1	2.5/3.3	1.2	-	-40/105	T/A	AUTO
KIOXIA	THGJFGT1E45BAIL	512Gb TLC x 4	256GB	3D	3.1	2.5/3.3	1.2	-	-25/85	T/A
KIOXIA	THGJFGT2T85BAIR	512Gb TLC x 8	512GB	3D	3.1	2.5/3.3	1.2	-	-25/85	T/A

Source page 5

Manufacturer	Part number	Device size (bits)	Byte size	Process	Version	VCC （V）	VCCQ （V）	VCCQ2 （V）	Temperature (°C)	RK3576	Remarks
MICRON	MTFC64GAZAOTD-AIT	256Gb TLC x 2	64GB	3D	2.1	3.3	-	1.8	-40/105	T/A	AUTO
MICRON	MTFC128GAZAOTD-AIT	256Gb TLC x 4	128GB	3D	2.1	3.3	-	1.8	-40/105	T/A	AUTO
MICRON	MTFC256GAZAOTD-AIT	256Gb TLC x 8	256GB	3D	2.1	3.3	-	1.8	-40/105	T/A	AUTO
MICRON	MTFC128GBCAVHF-WT	512Gb TLC x 2	128GB	3D	3.1	2.5	1.2	-	-25/85	T/A
MICRON	MTFC128GBCAVTC-AAT	512Gb TLC x 2	128GB	3D	3.1	2.5	1.2	-	-40/105	T/A	AUTO
MICRON	MTFC256GBCAVTC-AAT	512Gb TLC x 4	256GB	3D	3.1	2.5	1.2	-	-40/105	T/A	AUTO
MICRON	MTFC256GBEAXHF-WT	512Gb TLC x 4	256GB	3D	4.0	2.5	1.2	-	-25/85	T/A
MICRON	MTFC128GBCAYAL-AAT	512Gb TLC x 2	128GB	3D	2.2	3.3	-	1.8	-40/105	T/A	AUTO
MICRON	MTFC256GBCAYAL-AAT	512Gb TLC x 4	256GB	3D	2.2	3.3	-	1.8	-40/105	T/A	AUTO

Source page 6

Manufacturer	Part number	Device size (bits)	Byte size	Process	Version	VCC （V）	VCCQ （V）	VCCQ2 （V）	Temperature (°C)	RK3576	Remarks
SAMSUNG	KLUDG4UHGC-B0E1	512Gb TLC x 2	128GB	3D	3.1	2.5	1.2	-	-25/85	T/A
SAMSUNG	KLUCG2U1DC-B0F1	512Gb TLC x 1	64GB	3D	2.2	3.3	-	1.8	-25/85	D/A
SAMSUNG	KLUDG2R1DE-B0F1	512Gb TLC x 2	128GB	3D	2.2	3.3	-	1.8	-25/85	D/A
SAMSUNG	KLUEG4R1DE-B0F1	512Gb TLC x 4	256GB	3D	2.2	3.3	-	1.8	-25/85	D/A
SAMSUNG	KLUCG4J1ZD-C0CQ	128Gb MLC x 4	64GB	2D	2.1	3.3	-	1.8	-40/105	T/A	AUTO
SAMSUNG	KLUDG8J1ZD-C0CQ	128Gb MLC x 8	128GB	2D	2.1	3.3	-	1.8	-40/105	T/A	AUTO
SAMSUNG	KLUDG4UHYB-B0EQ	256Gb TLC x 4	128GB	3D	3.1	2.5	1.2	-	-40/105	T/A	AUTO
SAMSUNG	KLUEG8UHYB-B0EQ	256Gb TLC 8 4	256GB	3D	3.1	2.5	1.2	-	-40/105	T/A	AUTO
SAMSUNG	KLUCG1R1JF-C0F1	512Gb TLC x 1	64GB	3D	2.2	3.3	-	1.8	-25/85	T/A
SAMSUNG	KLUDG2R1JF-C0F1	512Gb TLC x 2	128GB	3D	2.2	3.3	-	1.8	-25/85	T/A
SAMSUNG	KLUEG2N1JB-C0F1	1Tb TLC x 2	256GB	3D	2.2	3.3	-	1.8	-25/85	T/A
SAMSUNG	KLUFG4N1JB-C0F1	1Tb TLC x 4	512GB	3D	2.2	3.3	-	1.8	-25/85	D/A
SAMSUNG	KLUDG2R1VF-B0FQ	512Gb TLC x 2	128GB	3D	2.2	3.3	-	1.8	-25/85	T/A	AUTO
SAMSUNG	KLUCG1R1VF-B0FQ	512Gb TLC x 1	64GB	3D	2.2	3.3	-	1.8	-25/85	T/A	AUTO
SAMSUNG	KLUBG1R1VF-B0FQ	512Gb TLC x 1	32GB	3D	2.2	3.3	-	1.8	-25/85	T/A	AUTO

Source page 7

Manufacturer	Part number	Device size (bits)	Byte size	Process	Version	VCC （V）	VCCQ （V）	VCCQ2 （V）	Temperature (°C)	RK3576	Remarks
WD	SDINFDQ6-256G-ZA	512Gb TLC x 4	256GB	3D	3.1	2.5/3.3	1.2	-	-45/85	T/A	AUTO

Source page 8

Manufacturer	Part number	Device size (bits)	Byte size	Process	Version	VCC （V）	VCCQ （V）	VCCQ2 （V）	Temperature (°C)	RK3576
YMTC	YMUS8B4TF1D1C1	512Gb TLC x 2	128GB	3D	3.1	2.5	1.2	-	-25/85	D/A
YMTC	YMUS9B4TF2D1C1	512Gb TLC x 4	256GB	3D	3.1	2.5	1.2	-	-25/85	T/A
YMTC	YMUSAB4TF3D1C1	512Gb TLC x 8	512GB	3D	3.1	2.5	1.2	-	-25/85	T/A
YMTC	YMUS7B2TE1A2C1	512Gb TLC x 1	64GB	3D	2.2	3.3	-	1.8	-25/85	T/A
YMTC	YMUS8B2TE2A2C1	512Gb TLC x 2	128GB	3D	2.2	3.3	-	1.8	-25/85	D/A
YMTC	YMUS9B2TE3A2C1	512Gb TLC x 4	256GB	3D	2.2	3.3	-	1.8	-25/85	T/A
YMTC	YMUS8B5TH1A1C1	1Tb TLC x 1	128GB	3D	2.2	3.3	-	1.8	-25/85	T/A
YMTC	YMUS9B5TH2A1C1	1Tb TLC x 2	256GB	3D	2.2	3.3	-	1.8	-25/85	T/A
YMTC	YMUSAB5TH3A1C1	1Tb TLC x 4	512GB	3D	2.2	3.3	-	1.8	-25/85	T/A

Source page 9

Manufacturer	Part number	Device size (bits)	Byte size	Process	Version	VCC （V）	VCCQ （V）	VCCQ2 （V）	Temperature (°C)	RK3576
BIWIN	BWU3AKC26C128G	512Gb TLC x 2	128GB	3D	3.1	2.5	1.2	-	-25/85	T/A
BIWIN	BWU3AKC46C256G	512Gb TLC x 4	256GB	3D	3.1	2.5	1.2	-	-25/85	T/A
BIWIN	BWU2A0526B128G	512Gb TLC x 2	128GB	3D	2.2	3.3	-	1.8	-25/85	T/A
BIWIN	BWU2A0516B064G	512Gb TLC x 1	64GB	3D	2.2	3.3	-	1.8	-25/85	T/A

Source page 10

Manufacturer	Part number	Device size (bits)	Byte size	Process	Version	VCC （V）	VCCQ （V）	VCCQ2 （V）	Temperature (°C)	RK3576	Remarks
FORESEE	FEUDME064G-B8A19	512Gb TLC x 1	64GB	3D	2.1	3.3	-	1.8	-40/105	T/A	AUTO
FORESEE	FEUDME128G-B8A19	512Gb TLC x 2	128GB	3D	2.1	3.3	-	1.8	-40/105	T/A	AUTO
FORESEE	FEUDME256G-C8H09	512Gb TLC x 4	256GB	3D	3.1	2.5	1.2		-40/105	T/A	AUTO
FORESEE	FEUDNN064G-C2G07	512Gb TLC x 1	64GB	3D	2.2	3.3	-	1.8	-25/85	T/A
FORESEE	FEUDNN128G-C2G07	512Gb TLC x 2	128GB	3D	2.2	3.3	-	1.8	-25/85	T/A
FORESEE	FEUDNN256G-C2G07	512Gb TLC x 4	256GB	3D	2.2	3.3	-	1.8	-25/85	T/A
FORESEE	FEUDNN512G-C2G07	512Gb TLC x 8	256GB	3D	2.2	3.3	-	1.8	-25/85	T/A

Source page 11

Manufacturer	Part number	Device size (bits)	Byte size	Process	Version	VCC （V）	VCCQ （V）	VCCQ2 （V）	Temperature (°C)	RK3576	Remarks
HOSIN	HBE3-1280CHAA	512Gb TLC x 2	128GB	3D	2.2	3.3	-	1.8	-25/85	T/A

Source page 12

Manufacturer	Part number	Device size (bits)	Byte size	Process	Version	VCC （V）	VCCQ （V）	VCCQ2 （V）	Temperature (°C)	RK3576
Kingston	UFS256-CY14	512Gb TLC x 4	256GB	3D	3.1	2.5	1.2	-	-25/85	T/A
Kingston	UFS128-CY14	512Gb TLC x 2	128GB	3D	3.1	2.5	1.2	-	-25/85	T/A
Kingston	UFS256-TY7B	512Gb TLC x 4	256GB	3D	2.2	3.3	-	1.8	-25/85	T/A
Kingston	UFS128-TY7B	512Gb TLC x 2	128GB	3D	2.2	3.3	-	1.8	-25/85	T/A

Source page 13

Manufacturer	Part number	Device size (bits)	Byte size	Process	Version	VCC （V）	VCCQ （V）	VCCQ2 （V）	Temperature (°C)	RK3576
PHISON	PSUF22H17-B064SS	512Gb TLC x 1	64GB	3D	2.2	3.3	-	1.8	-25/85	T/A
PHISON	PSUF22H17-B128SS	512Gb TLC x 2	128GB	3D	2.2	3.3	-	1.8	-25/85	T/A
PHISON	PSUF22H17-B256SS	512Gb TLC x 4	256GB	3D	2.2	3.3	-	1.8	-25/85	T/A

Source page 14

Manufacturer	Part number	Device size (bits)	Byte size	Process	Version	VCC （V）	VCCQ （V）	VCCQ2 （V）	Temperature (°C)	RK3576	Remarks
SMI	SM671PBD-C8V	1Tb TLC x 1	128GB	3D	3.1	2.5	1.2	-	-40/105	T/A	AUTO
SMI	SM671PBE-C8V	1Tb TLC x 2	256GB	3D	3.1	2.5	1.2	-	-40/105	T/A	AUTO
SMI	SM671PBF-C8V	1Tb TLC x 4	512GB	3D	3.1	2.5	1.2	-	-40/105	T/A	AUTO

Source page 15

Manufacturer	Part number	Device size (bits)	Byte size	Process	Version	VCC （V）	VCCQ （V）	VCCQ2 （V）	Temperature (°C)	RK3576	Remarks
Rayson	RS80A64G4M05B	512Gb TLC x 1	64GB	3D	2.2	3.3	-	1.8	-25/85	T/A

Official references

Rockchip Redmine

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