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RK182X SO-DIMM module: architecture, 260-pin pinout, power and integration

RK182X SO-DIMM module: architecture, 260-pin pinout, power and integration

· ArmSoM · 15 min read

RK182X is an AI coprocessor for inference and machine vision. This guide uses the supplied RK182X SODIMM Module Datasheet Rev 1.1 for ArmSoM-host or custom-carrier evaluation. It is not a standalone general-purpose host, and a 260-pin SO-DIMM outline does not establish interchangeability with AIM7, Jetson or memory sockets.

Download the complete original PDF, 24 pages

This engineering reading guide includes the complete 260-pin signal list and principal electrical limits. Consult the original for all feature details and interface test conditions. No ArmSoM compatibility or model-performance measurements were performed.

1. Models, compute and memory

Module Chip Built-in DRAM Source model positioning
RM1820SA0 RK1820 2.5GB 3B
RM1828SA0 RK1828 5GB 7B

The three independent 64-bit RISC-V cores are SRV, VRV0 and VRV1. SRV implements RV64GCB and the vector cores RV64GCBV. Each has an H/F/D FPU, 32KB instruction cache, 32KB data cache and 128KB L2. VRV0/VRV1 add 128-bit vector units. One source line says VR0; VRV0 is used here from context, with the discrepancy recorded.

The NPU is rated up to 20 TOPS INT8, supporting INT4/INT8/INT16/FP8/FP16/BF16. TensorFlow, MXNet, PyTorch, Caffe, Tflite, Onnx NN and Android NN are listed across the source. Listing a framework does not guarantee every version, operator or model.

BootROM supports FSPI/eMMC/SD/MMC boot and USB0/UART0/PCIe0 downloading. There is 512KB system SRAM and module SPI Flash. The combined SDMMC modes are exclusive: eMMC4.51 supports HS200 and 1/4/8-bit buses, without CMD Queue; SD3.0/MMC4.51 supports 1/4-bit.

2. System and image-processing blocks

The clock unit has four PLLs and a 24MHz input, individual gating and global/local software reset. PMU domains are VDD_TOP, VDD_LOGIC and VDD_PMU. There are six 64-bit timers, three 32-bit watchdogs and twelve inter-core mailboxes. DMA has two physical channels, 24 logical channels and 22 peripheral request groups, with memory/peripheral, linked-list and multi-block transfers.

Interrupt inputs number 160 for SRV and 64 for VRV, with M/S-mode software interrupts, high-level sensitivity and programmable priorities. The crypto engine lists AES-128/192/256, SM4, SHA-1, SHA-256/224, MD5, SM3, related HMAC, RSA up to4096-bit, ECC up to256-bit, SM2 and multistage Key-ladder. Presence is not a recommendation to adopt every legacy algorithm.

JPEG encoding uses Baseline/JFIF1.02 at16×16–65520×65520; decoding starts at48×48. The decoder’s RG888 source spelling is retained rather than silently changed to RGB888.

RGA lists BT.601/709 conversion, dithering, 8192×8192 source/4096×4096 destination, 1/16–16 scaling, 0/90/180/270-degree rotation, XY mirroring, BitBLT, Alpha blending, YUV2YUV CSC and OSD inversion. Upscaling uses bicubic filtering but the source switches to bilinear for source>1992; retain this threshold pending SDK confirmation. Several10-bit inputs are clipped to8-bit, so this is not a promise of an end-to-end10-bit output pipeline.

3. Interfaces and multiplexing

USB/PCIe multiplexing, source Fig.1-1

Two Combo PHYs serve two PCIe2.1 controllers and one USB3.0 DRD controller; USB SuperSpeed is multiplexed to one PHY. Each PCIe link is x1, RC/EP, 2.5/5.0Gbps per direction. Do not count all USB/PCIe functions as unconditionally simultaneous ports.

Interface Source capability
Ethernet One MAC, RGMII, 10/100/1000Mbps, full/half duplex, TSO/USO, IEEE1588-2002/2008
USB2.0 DRD 480/12/1.5Mbps, EHCI1.0, OHCI1.0a
USB3.0 DRD Static Device or static xHCI Host
SPI Two controllers, two chip selects, configurable master/slave
I2C Four masters, 7/10-bit addresses, 100k/400k/1M bit/s
SMBus One slave, byte/word/32-bit/block operations, PEC, Alert, UDID, clock stretching
UART Three, 64-byte TX/RX FIFOs, 5/6/7/8-bit, up to4Mbps; UART2 flow control/RS485
PWM Three, capture, continuous/one-shot, two-stage divider, power-key capture, frequency meter, counter
SAI One, 4 TX+4 RX, I2S/PCM/TDM, up to128 slots, 8–32-bit slot/valid lengths
GPIO Level/rising/falling/both-edge interrupts, polarity, weak pulls, drive strength
OTP 8K bits, 6.5K for secure applications; Program/Read/Idle

4. Typical host connections

Module block diagram, Fig.1-2 PCIe connection, Fig.1-3 USB3.0 connection, Fig.1-4

The PCIe example uses host RC, module PCIe0 EP and12V/4A, with a2.7kΩ boot-selection resistor. The USB example selects USB0 with0Ω. Review reset, CLKREQ, optional WAKE/PERST, SMBus, debug UART/JTAG and fan PWM/tachometer against the diagrams and final reference design. Do not power an unverified carrier based on prose alone.

5. Mechanics and 260-pin list

The module measures69.6×45mm with a260-pin SO-DIMM connector at0.5mm pitch. Bare-board drawings show1.20±0.12mm PCB thickness and2.40mm/1.25mm maximum component heights on the two sides. Allow for the heatsink and socket; dimensions are in mm.

Bare top and side, Fig.2-1/2-2 Bare bottom and heatsink top/side, Fig.2-3 to2-5 Heatsink bottom, Fig.2-6

Complete260-pin list; preserve mux names, RSVD, NC and the source double slash on pin195.

Pin Original signal name
1 GND
2 GND
3 RSVD
4 RSVD
5 RSVD
6 RSVD
7 GND
8 GND
9 RSVD
10 RSVD
11 RSVD
12 RSVD
13 GND
14 GND
15 RSVD
16 RSVD
17 RSVD
18 RSVD
19 GND
20 GND
21 3.3V OUT
22 RSVD
23 3.3V OUT
24 RSVD
25 GND
26 GND
27 1.8V OUT
28 RSVD
29 1.8V OUT
30 RSVD
31 GND
32 GND
33 VCCIO2_IN
34 RSVD
35 VCCIO3_IN
36 RSVD
37 GND
38 GND
39 RSVD
40 RSVD
41 RSVD
42 RSVD
43 GND
44 GND
45 RSVD
46 RSVD
47 RSVD
48 RSVD
49 GND
50 GND
51 RSVD
52 RSVD
53 RSVD
54 RSVD
55 GND
56 GND
57 RSVD
58 RSVD
59 RSVD
60 RSVD
61 GND
62 GND
63 RSVD
64 RSVD
65 RSVD
66 RSVD
67 GND
68 GND
69 RSVD
70 RSVD
71 RSVD
72 RSVD
73 GND
74 GND
75 RSVD
76 RSVD
77 RSVD
78 RSVD
79 GND
80 GND
81 RSVD
82 RSVD
83 RSVD
84 RSVD
85 GND
86 GND
87 USB0_DRD_VBUSDET
88 RSVD
89 ETH_TXD0/PCIE1_WAKEN_M2/PWM_CH0_M1/SPI0_MOSI_M2/GPIO1_A6_d
90 RSVD
91 ETH_TXCTL/PCIE1_CLKREQN_M2/SPI0_CLK_M2/GPIO1_B2_d
92 RSVD
93 ETH_TXD1/PCIE1_PERSTN_M2/SPI0_MISO_M2/GPIO1_A7_d
94 RSVD
95 ETH_RXD0/SPI0_CS0N_M2/GPIO1_B4_d
96 RSVD
97 ETH_RXD1/SPI0_CS1N_M2/GPIO1_B5_d
98 RSVD
99 SARADC_IN6/PCIE0_PERSTN_M1/I2C4_SCL_M0/SAI_SDI2_M2/UART2_TX_M0/PWM_CH6_M2/GPIO1_D6_d
100 RSVD
101 SARADC_IN7/PCIE0_WAKEN_M1/I2C4_SDA_M0/SAI_SDI3_M2/UART2_RX_M0/PWM_CH7_M2/GPIO1_D7_d
102 GND
103 RSVD
104 ETH_TXD2/SPI1_MOSI_M2/GPIO1_B0_d
105 RSVD
106 ETH_TXCLK/I2C1_SCL_M1/SPI1_CLK_M2/GPIO1_B3_d
107 GND
108 ETH_TXD3/SPI1_MISO_M2/GPIO1_B1_d
109 USB0_DRD_DM
110 ETH_RXD2/I2C1_SDA_M1/SPI1_CS0N_M2/GPIO1_B6_d
111 USB0_DRD_DP
112 ETH_RXD3/I2C4_SCL_M1/SPI1_CS1N_M2/GPIO1_B7_d
113 GND
114 RSVD
115 USB1_DRD_DM
116 RSVD
117 USB1_DRD_DP
118 SARADC_IN5/PCIE0_CLKREQN_M1/SAI_SDI1_M2/SPI0_CS1N_M1/GPIO1_D5_d
119 GND
120 RSVD
121 RSVD
122 RSVD
123 RSVD
124 ETH_RXCTL/PCIE0_WAKEN_M2/GPIO1_C0_d
125 GND
126 ETH_RXCLK/I2C4_SDA_M1/GPIO1_C1_d
127 USB0_DRD_ID
128 ETH_MDC/PCIE0_PERSTN_M2/GPIO1_C2_d
129 GND
130 ETH_MDIO/PCIE0_CLKREQN_M2/GPIO1_C3_d
131 PCIE0_RXN/USB0_DRD_SSRXN_M0
132 GND
133 PCIE0_RXP/USB0_DRD_SSRXP_M0
134 PCIE0_TXN/USB0_DRD_SSTXN_M0
135 GND
136 PCIE0_TXP/USB0_DRD_SSTXP_M0
137 RSVD
138 GND
139 RSVD
140 RSVD
141 GND
142 RSVD
143 RSVD
144 GND
145 RSVD
146 GND
147 GND
148 RSVD
149 RSVD
150 RSVD
151 RSVD
152 GND
153 GND
154 RSVD
155 RSVD
156 RSVD
157 RSVD
158 GND
159 GND
160 PCIE0_REFCLKN
161 PCIE1_RXN/USB0_DRD_SSRXN_M1
162 PCIE0_REFCLKP
163 PCIE1_RXP/USB0_DRD_SSRXP_M1
164 GND
165 GND
166 PCIE1_TXN/USB0_DRD_SSTXN_M1
167 RSVD
168 PCIE1_TXP/USB0_DRD_SSTXP_M1
169 RSVD
170 GND
171 GND
172 RSVD
173 PCIE1_REFCLKN
174 RSVD
175 PCIE1_REFCLKP
176 GND
177 GND
178 RSVD
179 I2C2_SCL_M0/UART1_CTSN_M0/PCIE0_WAKEN_M0/SMBUS_ALERT_M0/SAI_SDI0_M0/SAI_SDO3_M0/GPIO0_B5_d
180 PCIE0_CLKREQN_M0/SAI_LRCK_M0/GPIO0_B7_d
181 I2C2_SDA_M0/UART1_RTSN_M0/PCIE0_PERSTN_M0/SAI_SCLK_M0/GPIO0_B6_d
182 RSVD
183 RSVD
184 RSVD
185 ETH_CLK_25M_OUT/I2C2_SCL_M1/SAI_SDO2_M2/UART2_CTSN_M0/SPI1_CS1N_M1/GPIO1_C4_d
186 RSVD
187 ETH_MCLK/I2C2_SDA_M1/SAI_SDO1_M2/UART2_RTSN_M0/PWM_CH0_M2/SPI1_MOSI_M1/GPIO1_C5_d
188 RSVD
189 SARADC_IN2/SMBUS_SCL_M1/I2C3_SCL_M1/SAI_SDO3_M2/UART1_TX_M1/PWM_CH6_M1/SPI0_MOSI_M1/GPIO1_D2_d
190 RSVD
191 SARADC_IN3/SMBUS_SDA_M1/I2C3_SDA_M1/UART1_RX_M1/PWM_CH7_M1/SPI0_MISO_M1/GPIO1_D3_d
192 RSVD
193 SARADC_IN4/SMBUS_ALERT_M1/SAI_SDO0_M2/UART1_CTSN_M1/SPI0_CS0N_M1/GPIO1_D4_d
194 RSVD
195 PCIE1_CLKREQN_M0/SAI_SDI0_M2/UART1_RTSN_M1//SPI0_CLK_M1/GPIO1_D1_d
196 RSVD
197 ETH_PPSTRIG/PCIE1_PERSTN_M0/SAI_LRCK_M2/SPI1_CLK_M1/GPIO1_D0_d
198 RSVD
199 ETH_PPSCLK/PCIE1_WAKEN_M0/SAI_SCLK_M2/SPI1_CS0N_M1/GPIO1_C7_d
200 GND
201 GND
202 RSVD
203 JTAG_TCK_M0/UART1_TX_M0_d
204 RSVD
205 JTAG_TMS_M0/UART1_RX_M0_d
206 I2C3_SCL_M0/PWM_CH6_M0/SPI1_CLK_M0/SMBUS_SCL_M0/SAI_SDI2_M0/SAI_SDO1_M0/GPIO0_B3_d
207 RSVD
208 I2C3_SDA_M0/PWM_CH7_M0/SPI1_MOSI_M0/SMBUS_SDA_M0/SAI_SDI1_M0/SAI_SDO2_M0/GPIO0_B4_d
209 RSVD
210 RSVD
211 ETH_PTP_REFCLK/SAI_MCLK_M2/SPI1_MISO_M1/GPIO1_C6_d
212 RSVD
213 RSVD
214 SARADC_IN0_BOOT
215 RSVD
216 RSVD
217 NC(MODULE_ID)
218 PWR_CTRL1/PWM_CH0_M0/SPI1_CS1N_M0/GPIO0_A3_d
219 SDMMC_D0/SAI_SDO2_M1/UART1_CTSN_M2/GPIO0_D2_u
220 SDMMC_D7/I2C2_SDA_M2/SAI_SDO0_M1/UART2_RTSN_M2/PCIE1_WAKEN_M1/GPIO1_A1_u
221 SDMMC_D1/SAI_SDO3_M1/UART1_RTSN_M2/GPIO0_D3_u
222 SDMMC_D6/I2C2_SCL_M2/SAI_SDI0_M1/UART2_CTSN_M2/SMBUS_ALERT_M2/GPIO1_A0_u
223 SDMMC_D2/SAI_SDI2_M1/UART1_TX_M2/GPIO0_D4_u
224 SDMMC_D5/I2C4_SDA_M2/SAI_LRCK_M1/UART2_RX_M2/SMBUS_SDA_M2/GPIO0_D7_u
225 SDMMC_D3/SAI_SDI3_M1/UART1_RX_M2/GPIO0_D5_u
226 SDMMC_D4/I2C4_SCL_M2/SAI_SCLK_M1/UART2_TX_M2/SMBUS_SCL_M2/GPIO0_D6_u
227 SDMMC_CMD/GPIO1_A2_u
228 RSVD
229 SDMMC_CLK_OUT/SAI_SDO1_M1/GPIO1_A3_d
230 RSVD
231 GND
232 SDMMC_RSTN/I2C3_SCL_M2/SAI_SDI1_M1/PCIE1_PERSTN_M1/GPIO1_A4_u
233 RSVD
234 SDMMC_DETN/I2C3_SDA_M2/SAI_MCLK_M1/PCIE1_CLKREQN_M1/GPIO1_A5_u
235 RSVD
236 JTAG_TCK_M1/UART0_TX_u
237 POWER_EN_IN
238 JTAG_TMS_M1/UART0_RX_u
239 RESETN_IN_u
240 Sleep/Wake(GPIO0_A0)_d
241 GND
242 GND
243 GND
244 GND
245 GND
246 GND
247 GND
248 GND
249 GND
250 GND
251 VCC_IN
252 VCC_IN
253 VCC_IN
254 VCC_IN
255 VCC_IN
256 VCC_IN
257 VCC_IN
258 VCC_IN
259 VCC_IN
260 VCC_IN

6. Power, control and operating conditions

VCC_IN occupies pins251–260. POWER_EN_IN237 is high-on/low-off, with100kΩ pulldown and input type1.5V to VCC_IN. RESETN_IN239 is active-low with1kΩ pullup to3.3V. Sleep/Wake240 is an optional3.3V-domain GPIO. SARADC_IN0_BOOT214 has10kΩ pullup to1.8V. MODULE_ID217 is reserved and unused.

Pins21/23 output3.3V and27/29 output1.8V, primarily for VCCIO2/VCCIO3 and associated peripherals; pins33/35 are their inputs. External loads increase VCC_IN demand. Relevant GPIO0 pins use fixed3.3V; the SDMMC group GPIO0_D2 through GPIO1_A5 uses VCCIO2; the GPIO1_A6–GPIO1_D7 group uses VCCIO3. Check full membership in source Table2-4.

Parameter/condition Min Typ Max Unit
Operating input voltage 8.0 12.0 14.4 V
Supply current 4.0 - 5.0 A
3.3V output peak current - - 0.8 A
1.8V output peak current - - 0.3 A
VCCIO1.8V domain 1.62 1.8 1.98 V
VCCIO3.3V domain 2.97 3.3 3.63 V
Storage temperature -20 - 70 °C
Storage humidity, non-condensing 30 - 70 %
Ambient operating temperature TBD 25 TBD °C
Recommended junction temperature - - 95 °C
Absolute VCC_IN -0.3 - 18 V
Absolute VCCIO -0.3 - 3.8 V
Absolute junction temperature NA - 105 °C
Output voltage accuracy -3 - 3 %

The4–5A supply-current entry is not a claim of constant consumption in every mode. The source recommends12V considering a typical0.5A socket-contact rating, and says each contact must remain below0.5A when supply capability exceeds40W. Average inference power is insufficient for supply sizing.

7. Revision issues, SARADC and thermal limits

  • Filename date20251016, cover Rev1.1/August2025, revision history only2025-08-20 Rev1.0: no publication date or full revision history is inferred.
  • SARADC features say seven channels including boot selection, 13-bit, up to2MS/s; diagram says×6; Table3-6 says eight channels and typical1MS/s, ENOB11.2 typical/13 maximum. All statements remain distinct pending clarification.
  • Analog range is0–1.8V with a separately listed3.3V maximum, not a guaranteed measurement range. DNL is±1/±3LSB and INL±2/±6LSB typical/maximum; SINAD69.2dB, THD77.3dB. Conditions include fS=1MS/s, fclk=24MHz; SINAD also lists fOUT=1.17KHz.
  • Table3-7 pairs Tx de-emphasis level ratio with80–120ohm; wording/unit need confirmation. AC coupling75–200nF and UI399.88–400.12ps require mode context, not application to every rate.
  • Recommended junction maximum is95°C; absolute rating105°C. Ambient operating limits are TBD. Storage temperature is not operating temperature.
  • Chapter4 only references the separate Thermal Design Guide, not supplied here. Detailed cooling selection and power modes cannot be reconstructed from it.

8. Before ArmSoM integration

Confirm host RC/USB Host, connector and levels, then drivers, firmware, RKNN3, model conversion and cooling. Do not equate RKNN-Toolkit2/RK3588 onboard-NPU deployment with RK182X. AIM7/Sige7/LM7 are evaluation directions, not verified plug-in compatibility claims.

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